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Hybrid PCB on Rogers RO4350B and High Tg FR-4 4-Layer Mixed PCB on 4mil RO4350B and 0.3mm FR-4

(PCBs are custom-made products; the images and parameters shown are for reference only)


Introduction

Hello Everyone,
Today, we will discuss a type of 4-layer high-frequency PCB constructed from 4mil RO4350B and high Tg FR-4 materials.


This PCB is designed as a 4-layer structure, making it relatively simple and cost-effective, which is beneficial for entering new markets.


Let's Explore the Build-Up


The first and second layers, as well as the third and fourth layers, consist of 4mil (0.102mm) RO4350B cores. This fixed thickness is crucial for maintaining the electrical length of the RF lines on the circuit board. The dielectric material in the middle is FR-4 epoxy glass, which bonds the cores on both the top and bottom sides. The inner layer copper weight is 0.5 ounces, while the outer layer is 1 ounce.


Detailed Specifications

Base Material

 RO4350B 0.102mm + Tg 170°C FR-4 0.30mm

Layer Count

 4 layers

Panel Size

 55mm x 132mm = 1 type = 1 piece

Surface Finish

 Immersion gold

Copper Weight

 Outer layer 35 μm / Inner layer 18 μm

Solder Mask / Legend

 Green / White

Final PCB Height

 1.0 mm

Special Technology

 Via in pad (hole filled) under BGA

Standard

 IPC 6012 Class 2

Packing

 25 panels are packed for shipment

Lead Time

 12 working days

Shelf Life

 6 months



Applications

The applications for RO4350B hybrid PCBs are diverse, including:

Preamplifiers,Radar sensors,Digital transmitters,Splitter modules,GPS antennas,Communication relays,Analog transmitters,4G antennas,RF transmitters,Wi-Fi amplifiers,RFID systems,Attenuators


Advantages of RO4350B Hybrid PCBs

1)Stable Dielectric Constant: RO4350B maintains a consistent dielectric constant across a broad frequency range, making it ideal for broadband applications.
2)Improved Signal Integrity: Enhances performance compared to all-FR4 stack-ups.
3)Cost Efficiency: Reduces costs compared to stack-ups made entirely of low-loss materials.
4)Minimized Signal Loss: Effective at high frequencies.
5)Robust Capabilities: We meet your PCB requirements from prototypes to mass production, backed by certifications including IATF 16949 (2016), ISO 14001 (2015), ISO 9001 (2015), and UL certification for quality assurance.


Thank you for reading! Feel free to contact us for any inquiries regarding RF PCBs.


Appendix: Our PCB Capability 2022

Click to expand/collapse the table

Parameter

Value

 Layer Counts 

1-32

 Substrate Material

 RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc.

 Maximum Size

 Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm

 Board Outline Tolerance

 ±0.0059" (0.15mm)

 PCB Thickness

0.0157" - 0.3937" (0.40mm--10.00mm)

Thickness Tolerance(T≥0.8mm)

 ±8%

Thickness Tolerance(t<0.8mm)

 ±10%

 Insulation Layer Thickness

0.00295" - 0.1969" (0.075mm--5.00mm)

 Minimum Track

0.003" (0.075mm)

 Minimum Space

 0.003" (0.075mm)

 Outer Copper Thickness

 35µm--420µm (1oz-12oz)

 Inner Copper Thickness

 17µm--350µm (0.5oz - 10oz)

 Drill Hole(Mechanical)

0.0059" - 0.25" (0.15mm--6.35mm)

 Finished Hole(Mechanical)

0.0039"-0.248" (0.10mm--6.30mm)

DiameterTolerance(Mechanical)

0.00295" (0.075mm)

 Registration (Mechanical)

0.00197" (0.05mm)

 Aspect Ratio

 12:1

 Solder Mask Type

 LPI

 Min Soldermask Bridge

0.00315" (0.08mm)

 Min Soldermask Clearance

0.00197" (0.05mm)

 Plug via Diameter

0.0098" - 0.0236" (0.25mm--0.60mm)

Impedance Control Tolerance

 ±10%

 Surface Finish

HASL,HASL LF,ENIG,Immersion Tin,Immersion Silver, OSP, Gold Finger, Pure gold plated etc.



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